Reflow Touch Screen BGA Rework Station

1.  Product application of reflow bga rework station DH-C1

The Reflow Touch Screen BGA Rework Station is a high-tech device used for reworking and repairing surface-mount 

technology (SMT) components, including ball grid array (BGA) chips. It features a touchscreen interface for easy 

the operation, a powerful heating system, precise temperature control, and multiple safety features to ensure the integrity

 of delicate parts during rework.

The device uses a combination of infrared and hot air heating technologies to melt the solder balls on the BGA chip, 

allowing it to be removed and replaced on the printed circuit board (PCB). Its touchscreen interface allows the 

operator to set precise temperature and heating profiles, while the built-in thermocouple ensures accurate temperature

 measurement.

The Reflow Touch Screen BGA Rework Station also features a built-in vacuum pump to aid in the removal of the 

BGA chip, and a powerful cooling fan to prevent damage to the PCB or surrounding components. Its safety features 

include automatic overheating protection, short circuit protection, and a warning alarm to alert the operator of any 

issues during the rework process.

2. Product specification of reflow bga rework station DH-C1

 

3. Product  advantages of  reflow bga rework station DH-C1

 

4. Product details of  reflow  bga rework station DH-C1 

Flexible delivery ：By DHL, TNT, FEDEX, Air shipping, Sea shipping and Land transportation etc. taking 3~30 

days to arrive at destination according to different shipping ways.

 

7. Contact us for more details of BGA rework station

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8.Learn something related about BGA

Advantages of BGA :

• Improved PCB design as a result of lower track density.

• The BGA package is robust.

• Lower thermal resistance.

• Improved high speed performance and connectivity.

 

What's the difference between LGA, BGA, and PGA sockets?

LGA is Land Grid Array. PGA is Pin Grid Array. BGA is Ball Grid Array.

LGA is what you're going to get right now. The CPU has metal contacts flush on the surface, pins in the socket.
PGA is the other way around. The pins are on the chip.
BGA is for CPUs that will be soldered into place (think laptops and consoles).

LGA are desktop sockets.

BGA are laptop sockets where the CPU is soldered to the board.

PGA are laptop sockets where the CPU may be able to be removed.

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